Dicing solutions

Dicing solutions Simac

Dicing solutions

Simac Masic offers a wide variety of dicing solutions. We offers solutions for BGA dicing, Led dicing, QFN dicing, LTCC dicing and GaAs dicing. 

What does package BGA stand for?

Ball Grid Array (BGA) packages are based upon wire-bonded or flip-chipped dies mounted on an FR4/5 or BT resin based laminate. The back side of the dice is usually encapsulated in an epoxy resin. The package has no leads and connects to the PCB by an array of solder balls. Typical thicknesses are 0.9 - 2.0 mm (including solder balls). Most common package sizes are 4x4 to 20x20 mm.

Major considerations
To reach the best cut quality during dicing process operator has to consider

  • Chipping
  • Slivers
  • Protrusions
  • Trace shorts

What does LED package singulation dicing consist of?

Normally the LED package singulation dicing is consisting of a basic substrate on which multiple LED are mounted.
Standard substrates are Ceramic, PCB and QFN.

Major considerations
To reach the best cut quality during dicing process operator has to consider

  • Smearing
  • Chipping
  • Cracks
  • Delamination
  • Silicon or copper burrs 

What is QFN package singulation dicing?

QFN (Quad Flat No-Lead) package singulation dicing consist of a copper lead frame using half-encapsulation techniques exposing the rearside of the dice pad. Standard dice sizes are 3x3 up to 10x10mm. QFN has 3 types.

  1. Standard HE QFN. Thick 1.5-2.5mm with approx.. 0.5mm copper lead frame.

  2. Thin QFN. Thick 0.4-ß.6mm with max. 0.15mm copper lead frame.

  3. Power QFN. Thick 0.8-1.2mm with max. 0.2mm copper lead frame.

Major considerations
To reach the best cut quality during dicing process operator has to consider

  • Burrs
  • Chipping
  • Melting
  • Lead smearing
  • Delaminations

What does LTCC package stand for?

Low Temperature Co-fired Ceramic package singulation Dicing (LTCC)
substrates consists of laminated individual unfired tapes with on the surface printed conductor lines on top of each other, fired together in a single step. The substrates with low dielectric loss and low constant. Further enabled to embed multiple layers of components in a multilayer structure.

Major considerations
To reach the best cut quality during dicing process operator has to consider

  • Metal burrs
  • Ceramic chipping
  • Cracks
  • Package size

What does GaAs dicing stand for?

GaAs (Gallium Arsenide) is a semiconductor material with a typical direct bandgap. This enables it to emit light being used in the LED industry.  The high speed of Gallium arsenide enables it to use in RF devices like microwaves and mobile phones. Usually for military applications such as smart weapons and radar. Due to high volume of arsenic, Gallium arsenide is considered hazardous.

Major considerations
For safe dicing and to reach the best cut quality during dicing process operator has to consider

  • Metal burrs
  • Top & back-side chipping
  • Cracking due to material crystallographic structure
  • Toxity of GaAs dust  

                       

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