MPP MICRO POINT PRO LTD. iBond5000 bonder

The iBond5000-ball is an advanced MPP bonder used for process development, production, research or added manufacturing support, iBond5000 provides the high yield and excellent repeatability needed for every gold ball bonding application including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices Lasers and much more.

Brochure MPP Micro Point Pro iBond5000-ball

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