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Manual wire bonders Micro Point Pro Ltd.
MPP with extensive experience in manufacturing high-precision bonding tools have recently purchased the former Kulicke & Soffa manual wire bonder division into their company.

The MPP range of manual wire bonders includes manual and semi-automatic systems for gold ball, wedge and ribbon bonding. The equipment is used for process development, production or research, provide excellent ease of use, optimum bond quality and repeatability, plus the reliability needed for the most challenging bonding applications. MPP wire bonders are available with Semi-automatic and manual operation modes, individual bond parameter control and capacity for a wide range of fine wire diameters enable ease of use in gold ball bonding, ball bumping, coining, security bonding, single-point TAB, thermosonic, aluminium or gold wedge and ribbon bonding applications.


Bent u benieuwd naar onze producten voor de halfgeleider industrie zie hier onze productenlijst

 

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