MPP MICRO POINT PRO LTD. iBond5000-ball bonder

The iBond5000-ball is an advanced MPP bonder used for process development, production, research or added manufacturing support, iBond5000 provides the high yield and excellent repeatability needed for every gold ball bonding application including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices Lasers and much more.

Brochure MPP iBond5000-ball

Kan Simac u van dienst zijn met een MPP iBond5000 bonder? Klik op onderstaande button of bel ons.


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